JPH0615425Y2 - 銅バー結合形基板 - Google Patents
銅バー結合形基板Info
- Publication number
- JPH0615425Y2 JPH0615425Y2 JP1988047239U JP4723988U JPH0615425Y2 JP H0615425 Y2 JPH0615425 Y2 JP H0615425Y2 JP 1988047239 U JP1988047239 U JP 1988047239U JP 4723988 U JP4723988 U JP 4723988U JP H0615425 Y2 JPH0615425 Y2 JP H0615425Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper bar
- wiring board
- printed wiring
- module
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052802 copper Inorganic materials 0.000 title claims description 72
- 239000010949 copper Substances 0.000 title claims description 72
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 68
- 239000000758 substrate Substances 0.000 title claims description 15
- 239000004020 conductor Substances 0.000 claims description 13
- 150000001879 copper Chemical class 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988047239U JPH0615425Y2 (ja) | 1988-04-07 | 1988-04-07 | 銅バー結合形基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988047239U JPH0615425Y2 (ja) | 1988-04-07 | 1988-04-07 | 銅バー結合形基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01150378U JPH01150378U (en]) | 1989-10-18 |
JPH0615425Y2 true JPH0615425Y2 (ja) | 1994-04-20 |
Family
ID=31273462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988047239U Expired - Lifetime JPH0615425Y2 (ja) | 1988-04-07 | 1988-04-07 | 銅バー結合形基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0615425Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6034755B2 (ja) * | 2013-06-14 | 2016-11-30 | 矢崎総業株式会社 | 端子構造 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6334221Y2 (en]) * | 1980-02-28 | 1988-09-12 | ||
JPS58131674A (ja) * | 1982-01-30 | 1983-08-05 | 日本メクトロン株式会社 | 電源母線の接続構造 |
-
1988
- 1988-04-07 JP JP1988047239U patent/JPH0615425Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01150378U (en]) | 1989-10-18 |
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